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IBL Expands the CCS100 with a High-Performance Vacuum Module for Low-Void Inline Vapour-Phase Soldering

The CCS100 VAC combines inline vapour-phase soldering with a high-performance vacuum process. The result is low-void solder joints, greater process reliability, and maximum reliability for demanding electronic assemblies.

Highly reliable solder joints for power electronics, BGAs, and demanding assemblies

With the CCS100 VAC IBL Löttechnik offers a high-performance solution for inline vapour-phase soldering with an integrated vacuum process. The optional vacuum module can be integrated into both new systems and existing ones CCS100 Systems be retrofitted. As a result, electronics manufacturers benefit from significantly reduced void formation and even greater process reliability, particularly for complex assemblies and thermally demanding applications.

„The combination of the precise heat transfer provided by vapour-phase soldering and an integrated vacuum process enables the production of low-void solder joints, even in critical applications.“

During the soldering process, a vacuum of up to 5 mbar is created, which reliably removes trapped gases from the solder joint. This results in more homogeneous solder joints with improved mechanical stability, optimized thermal conductivity, and greater long-term reliability. A low void rate plays a crucial role, particularly in ball grid arrays (BGAs), large-area thermal pads, power semiconductors, multilayer printed circuit boards, and power electronics assemblies. Air voids in the solder joint can increase thermal resistance, impair electrical performance, and reduce the service life of electronic assemblies. The CCS100 VAC minimizes these risks and helps electronics manufacturers reliably meet the highest quality standards.

Like all IBL vapor-phase soldering systems, the CCS100 VAC also utilizes the physical advantages of condensation soldering technology. Heat is transferred evenly to the assembly through the condensation of an inert process medium, Galden. Since the maximum temperature is limited by the medium’s boiling point, overheating of sensitive components is prevented. At the same time, the uniform heating ensures minimal temperature differences within the assembly and reduces thermal stresses. Another advantage is that, due to the oxygen-free process atmosphere, no additional nitrogen is required for vapor-phase soldering. This reduces both operating costs and the technical effort required for the process gas supply.

With the addition of the optional vacuum module, the CCS100 VAC becomes a particularly high-performance inline soldering system for manufacturers who demand the highest standards of process reliability, thermal management, and the reliability of their electronic assemblies.

With the addition of the optional vacuum module, the CCS100 VAC becomes a particularly high-performance inline soldering system for manufacturers who demand the highest standards of process reliability, thermal management, and the reliability of their electronic assemblies. The ability to retrofit existing systems also provides a cost-effective entry into the Vacuum Soldering Technology, without having to replace the entire production line. IBL Löttechnik would be happy to provide more information about its vapour-phase solutions and the associated vacuum options in a personal meeting, for example at the EFX 2026 in Stuttgart.

What soldering temperatures are reached during vapor-phase soldering?
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August 4, 2026

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July 28, 2026

With Advanced Process Control (APC) and Automatic Gradient Control (AGC), IBL Löttechnik will showcase intelligent software solutions for reproducible vapour-phase soldering processes at EFX 2026. These technologies reduce setup time, increase process reliability, and automate temperature control.
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