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Questions & Answers

Here is an overview of frequently asked questions and answers

Is vapour-phase soldering energy-efficient?

Yes, the process is considered energy-efficient because heat is transferred directly through the phase change of the medium. There is no need for complex heating profiles or long preheating phases, as is typical with conventional reflow ovens.

When are higher soldering temperatures required in vapour-phase soldering?

Higher soldering temperatures are required primarily for lead-free solders, as they have higher melting points. In such cases, fluids with higher boiling points are used to reliably reach the required temperature.

What are the advantages of a fixed soldering temperature in vapour-phase soldering?

The constant soldering temperature ensures that components cannot overheat. At the same time, it creates stable process conditions that enable consistent soldering quality. This feature makes vapour-phase soldering particularly reliable for demanding applications.

Why is Galden used in vapour-phase soldering?

Galden is used in soldering technology because it is a thermally stable heat transfer fluid with a precisely defined boiling point. This enables uniform and reproducible heat transfer, which is crucial for high-quality processes in electronics manufacturing.

How does the boiling point determine the soldering temperature in vapour-phase soldering?

In vapour-phase soldering, the maximum soldering temperature corresponds exactly to the boiling point of the medium used. As soon as the Galden fluid evaporates, the temperature cannot rise any higher. This automatically limits and precisely controls heat transfer.

What soldering temperature is reached during vapour-phase soldering in electronics manufacturing?

The soldering temperature in vapour-phase soldering typically ranges from 200 °C to 260 °C. It is determined by the boiling point of the heat transfer fluid used and remains constant throughout the entire process, ensuring a high degree of process reliability in electronics manufacturing.

Why is the vapour-phase soldering process so reproducible?

The vapour-phase soldering process is reproducible because the temperature is physically determined by the boiling point of the medium (max. 260°C). Combined with controlled process management and sensor technology, this creates stable and repeatable conditions that ensure consistent soldering quality.

What is the reflow phase in vapour-phase soldering?

The reflow phase is the step in the soldering process during which the solder paste melts and the electrical and mechanical connections between the components are formed. It begins as soon as the assembly reaches the required soldering temperature.

What temperature is reached during vapour-phase soldering?

The maximum temperature during vapour-phase soldering corresponds to the boiling point of the medium used and typically ranges between 200 °C and 260 °C. Higher temperatures are not possible, which makes the process particularly safe and controllable.

What happens during condensation in vapour-phase soldering?

In vapour-phase soldering, hot vapour condenses on the cooler assembly. This releases latent heat, which is transferred directly and evenly to all components. This process ensures uniform heating regardless of geometry or thermal mass.

How does the vapour-phase soldering process work, step by step?

The vapour-phase soldering process begins with the application of solder paste and the placement of components on the assembly. It is then placed in a vapour zone where a heated medium condenses and transfers heat. Once the reflow temperature is reached, the solder melts and bonds the components. This is followed by controlled cooling.

What role does vapour-phase soldering play in the automotive industry?

Vapour-phase soldering plays an important role in the automotive industry, particularly in the manufacture of modern electronic systems.

It is frequently used for control units, sensors, and power electronics. The uniform heating and high process reliability improve the long-term reliability of these systems.

Why is vapour-phase soldering used in defense technology?

Vapour-phase soldering is used in defense technology because it enables the reliable fabrication of complex and heterogeneous assemblies.

Electronic systems in this field often consist of components with varying thermal properties. This process ensures stable solder joints and high process reliability, even under demanding conditions.

What are the advantages of vapour-phase soldering in the aerospace industry?

In the aerospace industry, vapour-phase soldering offers maximum reliability and low defect rates.

The process ensures uniform heating even for complex assemblies and reduces typical soldering defects. At the same time, its high reproducibility enables the stable processes required for safety-critical applications.

Why is vapour-phase soldering particularly well-suited for medical technology?

Vapour-phase soldering is particularly well-suited for medical technology because it reliably protects sensitive and highly integrated components.

Uniform heating and the physically limited temperature (max. 260°C) prevent overheating. At the same time, high process stability ensures consistent quality, which is absolutely essential for medical applications. Suppliers such as IBL-Löttechnik support these requirements with precise soldering processes and specially developed system solutions.

In which industries is vapour-phase soldering used?

Vapour-phase soldering is used primarily in industries with high quality and safety requirements. These include, in particular, medical technology, aerospace, defense technology, and the automotive industry.

In these fields, flawless solder joints and reproducible processes are crucial to the functionality and safety of electronic systems. Companies such as IBL-Löttechnik offer specialized solutions and equipment for demanding applications.

What are the advantages of vapour-phase soldering over reflow soldering?

Vapour-phase soldering provides more uniform heat distribution than reflow soldering and prevents overheating due to a physically limited temperature (max. 260°C). This results in fewer soldering defects and greater process reliability, especially for complex assemblies.

For which assemblies is this process particularly suitable?

Vapour-phase soldering is particularly well-suited for complex assemblies where other methods reach their limits. These include:

high-density SMD assembly
assemblies with large temperature differences between individual components
sensitive components with low thermal tolerance
complex multilayer printed circuit boards

Process stability is a key advantage, especially in safety-critical applications.

What are the advantages of vapour-phase soldering over convection soldering?

Vapour-phase soldering provides more uniform heating and prevents localized overheating. Compared to convection soldering, this results in fewer soldering defects and greater process reliability, especially for complex assemblies.

Why can't overheating occur during vapour-phase soldering?

Overheating is prevented because the temperature is limited by the medium's boiling point. Once this point is reached (max. 260°C), the temperature no longer rises. This ensures that sensitive components are reliably protected.

Why is the heating so uniform in vapour-phase soldering?

The uniformity of the heating is based on the physical principle of condensation. Every point on the assembly that is cooler than the vapour automatically absorbs the same amount of energy. This results in a homogeneous temperature distribution, regardless of component size, material, or position on the circuit board.

Unlike convective processes, there are no local „hot spots“ or shadowed areas, which significantly improves process quality.

What temperature is reached during vapour-phase soldering?

The maximum temperature corresponds to the boiling point of the medium used and typically ranges between 200 °C and 260 °C. A higher temperature is physically impossible, which makes the process particularly safe. This eliminates the risk of components or substrates overheating.

What exactly happens during vapour-phase soldering?

In vapour-phase soldering, a special medium called Galden is heated until it vaporizes. The resulting vapour condenses on the cooler assembly, releasing heat in the process. Once the soldering temperature is reached, the solder paste melts and bonds the components electrically and mechanically.

What is vapour-phase soldering, explained simply?

Vapour-phase soldering is a reflow soldering process in which the assembly is heated not by hot air or radiation, but by condensing vapour. A special medium - in this case, Galden - is vaporized, and the assembly is placed within this vapor zone. The vapor condenses on the cooler surface of the PCB, releasing latent heat in the process. This energy is used to selectively melt the solder paste and create stable electrical connections.

Is Galden Reusable in Vapour-Phase Soldering?

Yes, Galden can be reused multiple times in the process. After condensation, it is recovered, filtered, and returned to the cycle, thereby reducing material consumption and operating costs.

How Does the Boiling Point of Galden Affect the Soldering Process?

Galden's boiling point determines the maximum temperature (max. 260°C) in the process. This prevents overheating and ensures constant, controlled heating of the assembly.

What Is Galden in Vapour-Phase Soldering?

Galden is used because it is thermally stable, chemically inert, and non-flammable. These properties ensure safe, reproducible, and gentle handling of assemblies in electronics manufacturing.

What is Galden in vapour-phase soldering?

Galden is a perfluorinated polyether (PFPE) used as a heat transfer fluid in vapour-phase soldering. It enables uniform heat transfer, and its boiling point determines the maximum process temperature.

What disadvantages of other soldering processes are avoided with vapour-phase soldering?

Vapour-phase soldering prevents common problems such as uneven heating, oxidation, and overheating. This reduces soldering defects such as tombstoning or cold joints and increases the reliability of the assemblies.

Why is vapour-phase soldering better suited for sensitive components?

Vapour-phase soldering protects sensitive components because the maximum temperature (max. 260°C) is limited by the boiling point of the medium. Overheating is not possible, which reliably prevents thermal damage.

Why is vapour-phase soldering better suited for complex assemblies?

Complex assemblies often consist of components with very different thermal masses and thermal conductivities. With vapour-phase soldering, however, heating occurs uniformly across the entire surface, regardless of these factors. This reduces temperature gradients, which minimizes thermal stresses and significantly lowers the risk of warping or component damage.