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Questions & Answers

Here is an overview of frequently asked questions and answers

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Vapour-phase soldering provides more uniform heat distribution than reflow soldering and prevents overheating due to a physically limited temperature (max. 260°C). This results in fewer soldering defects and greater process reliability, especially for complex assemblies.

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Complex assemblies often consist of components with very different thermal masses and thermal conductivities. With vapour-phase soldering, however, heating occurs uniformly across the entire surface, regardless of these factors. This reduces temperature gradients, which minimizes thermal stresses and significantly lowers the risk of warping or component damage.

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Vapour-phase soldering protects sensitive components because the maximum temperature (max. 260°C) is limited by the boiling point of the medium. Overheating is not possible, which reliably prevents thermal damage.

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Vapour-phase soldering prevents common problems such as uneven heating, oxidation, and overheating. This reduces soldering defects such as tombstoning or cold joints and increases the reliability of the assemblies.

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Galden is a perfluorinated polyether (PFPE) used as a heat transfer fluid in vapour-phase soldering. It enables uniform heat transfer, and its boiling point determines the maximum process temperature.

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Galden is used because it is thermally stable, chemically inert, and non-flammable. These properties ensure safe, reproducible, and gentle handling of assemblies in electronics manufacturing.

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Galden's boiling point determines the maximum temperature (max. 260°C) in the process. This prevents overheating and ensures constant, controlled heating of the assembly.

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Yes, Galden can be reused multiple times in the process. After condensation, it is recovered, filtered, and returned to the cycle, thereby reducing material consumption and operating costs.