Optional vacuum module for void-free inline soldering with the CCS100 VAC
The CCS100 can be equipped with a high-performance vacuum module and retrofitted. By combining vapor-phase soldering with an integrated vacuum process, the soldering system produces low-void, highly reliable solder joints, even for demanding components such as BGAs or complex assemblies used in power electronics or multilayer printed circuit boards. A vacuum of 5 mbar is generated during this process. The use of nitrogen can be eliminated.
Modular and customizable for medium to large series
Thanks to the multiple carrier system used, the CCS100 meets the requirements of medium to large series. A wide range of options are available to customers to adapt the soldering system to their specific needs.
Advantages of the modular design:
- low maintenance effort
- high system availability
Vapour Energy Control (VEC) - patented process innovation
Furthermore, the newly developed, patented Vapour Energy Control (VEC) has set a new benchmark in the field of process technologies for vapour phase soldering systems.
The advantages:
- extremely responsive control of automated inline soldering
- full flexibility in profile design
- reproducible soldering without moving the assembly in the steam
Modern control and complete data integration
The system control allows precise, repeatable soldering processes. Process values and steps can be viewed at any time.
Data management takes place via an integrated industrial PC, visualized via a 21.5″ HMI.
This technology enables:
- simple integration into existing networks
- comprehensive traceability functions
- seamless process data acquisition
Workpiece carrier for cycle time-optimized inline soldering
The CCS100 is designed for cycle time-optimized inline production. Individual assemblies and workpiece carrier systems with several assemblies can be soldered within the system. A multiple carrier system with a variable track configuration of the workpiece carriers can be integrated. The workpiece carriers are adapted to the assemblies to be soldered on a product-specific basis. A workpiece carrier return conveyor and automatic width adjustment of the conveyor belts also enable work to be minimized.
