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Vapour phase soldering reduces void formation

All soldering processes have one thing in common: they are able to securely attach components to special substrates. However, for greater process accuracy, higher quality solder joints, uniformly repeatable heating and lower reflow costs, vapor phase soldering (also known as condensation soldering or vapor phase reflow) offers the most flexible, simple and reliable reflow soldering process. This vapor phase soldering technology is ideally suited for all types of SMT components and carrier materials. It enables the processing of the complete component spectrum without complex installation and without temperature profiling and is therefore ideal for modern electronics production.

FAQs

News 09: Which Components Can Be Processed Using Vapor-Phase Soldering?
Which components can be processed using vapour-phase soldering?

October 7, 2026

These components pose a challenge in many soldering processes. Due to the uniform heat transfer, however, they can be processed reliably and consistently using vapour-phase soldering.
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News 08: How Is Temperature Control Ensured During Vapor-Phase Soldering?
How Temperature Control Works in Vapour-Phase Soldering

September 22, 2026

Physically stable temperature control during vapour-phase soldering through the heat released during condensation and precise control technology.
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