Vacuum soldering technology provides maximum solder quality for void-free soldering.
VAC745/765
Features
- Void-free solder joints with highest quality
- Inert atmosphere during the whole reflow and vacuum process
- Wide variety of adjustable solder profiles
- Low medium consumption due to 2-chamber design and medium recovery
- Temperature recording and profiling with 4 integrated channels
- Permanent data collection
- Medium level check and automatic medium filtering
- Integrated cooling fan
- Automatic monitoring of vacuum process
- Maintenance-free transport system (patented)