A special form of vapor phase soldering is vacuum vapor phase soldering. After the soldering paste has completely melted, the air is pumped out in the process chamber. The negative pressure ensures that gaseous inclusions are largely displaced to the outside in the soldering points and thus separated from the soldered joint. The result are solder joints without voids. This technology is particularly advantageous when the solder joints are to dissipate heat, since air inclusions increase the thermal resistance of the solder joint. In addition, voids impair the mechanical load-bearing capacity.