Vapour phase soldering systems from IBL offer electronics manufacturers a clear technological advantage: the soldering process is based on a physically defined maximum temperature of the heat transfer fluid, in this case Galden, which prevents the assemblies from overheating. The even flow of steam also ensures homogeneous heat distribution, even with complex PCBs with high mass differences or densely populated surfaces. Thanks to the precise control of the temperature profiles, the process can be adapted exactly to a wide range of assembly requirements. For particularly high demands on the quality of the solder joints, systems with an integrated vacuum option are available, which significantly reduce voids. A decisive factor in power electronics or safety-critical assemblies.