All soldering processes have one thing in common: they are able to securely attach components to special substrates. However, for greater process accuracy, higher quality solder joints, consistently repeatable heating and lower reflow costs, vapor phase soldering (also known as condensation soldering or vapor phase reflow) offers the most flexible, simple and reliable reflow soldering process. This vapor phase soldering technology is ideally suited for all types of SMT components and carrier materials. It enables the processing of the complete component spectrum without complex installation and without temperature profiling and is therefore ideal for modern electronics production.