SV260 Economy

SV 260

Professional tabletop vapour phase soldering system

The SV260 is an automated benchtop reflow soldering system with a two-chamber design in which the heat is transferred by condensed steam. This compact soldering system is designed for small batch production where flexibility and process reliability are crucial. The system is ideal for profiling with standardized production specifications. Program or parameter settings are entered via touch-screen.

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SV260 - space-saving reflow vapour phase machine

The SV260 vapour phase machine from the Economy series impresses with its 2-chamber design, simple operation and compact construction. It has been specially designed for development and prototype production, even soldering BGAs and LGAs reliably and precisely. The small footprint makes it perfect for development-related applications and the smallest production environments.

Decorative picture
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Maximum flexibility with minimum thermal load

The low soldering temperature and the homogeneous heat transfer of the SV260 reduce the thermal load on the soldering assemblies to a minimum. The SV260 therefore offers perfect conditions for flexible soldering tasks in the following areas, among others:

  • development and prototyping
  • small series production
  • laboratory operation
  • rework tasks

The simple and reliable soldering process is independent of the component weight. The system is therefore also predestined for flexible tasks in assembly and connection technology.

This entry system can be loaded manually from the front, includes standard soldering profiles, is intuitive to operate and easy to move. Thanks to these features, the SV260 is ideal as a small series soldering system which is specially tailored to the requirements of small production quantities.

Product highlights

  • desktop unit
  • live temperature recording without profiler
  • lowest energy and medium consumption thanks to 2-chamber design and integrated cooling
  • simple operation. Automatic soldering, program memory

Further added value

  • patented maintenance and vibration-free transport system
  • oxygen-free soldering without overheating the components
  • automatic or time-controlled soldering process
  • HMI touch panel
  • USB interface for saving profiles and machine data
  • connection for a suction unit
  • illuminated window in process chamber
  • 230V operation

Discover more

  • attachment for double-sided assemblies
  • support grid for workpiece carriers
  • ReSy - a device for repairing QFP's and BGA's
  • external cooling unit
  • roller table with integrated cooling unit
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Why IBL?

Technological lead for the highest soldering quality

Precise and safe soldering thanks to vapour phase technology

Integration into digital production

Networked soldering processes for the electronics production of tomorrow

Sustainable efficiency in operation

Energy-efficient processes and reuse of cardboard

Advice, service and partnership-based cooperation

IBL accompanies you from evaluation to series production

Technical data
DesignationValue
Width770 mm
Depth710 mm
Height680 mm
Weight110 kg
Max. Soldering material format260 x 300 x 70 mm
Max. Weight per carrier2.5 kg
Standard filling quantity3 kg
Water connection½"/2.5-5 bar
Max. heat output2.1 kW
Average power consumption0.9 kW/h
Tension208-240 VAC, 50/60 Hz
Fuse16 A gL / C16 A
DesignationValue
Width30.31 "
Depth27.95 "
Height26.77 "
Weight242.51 lbs
Max. Soldering material format10.24 x 11.81 x 2.76 "
Max. Weight per carrier5.51 lbs
Standard filling quantity6.61 lbs
Water connection½"/2.50-5 bar
Max. heat output2.10 kW
Average power consumption0.90 kW/h
Tension208-240 VAC, 50/60 Hz
Fuse16 A gL / C16 A

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