ReSy - Rework System

ReSy Rework

Gentle desoldering process with special rework program

ReSy is a fast and cost-effective tool for reworking components such as BGAs and QFBs. Individual components can be easily and gently removed from an assembly.

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The process is simple and efficient:

  • the repair system is connected to the component to be desoldered
  • together with the assembly, it goes through a special rework program in the vapour phase soldering system

Patented technology for sensitive assemblies

The heart of the ReSy system is the temperature-dependent lifting device, basis of the patented desoldering process.

Advantages of this gentle procedure:

  • after desoldering, components can be without violence take off
  • the assembly remains intact
  • often to reballing (e.g. for BGAs) be dispensed with
  • also a post-processing of the assembly is often not necessary

Repair instead of replace, efficient and gentle on materials

IBL understands its task not only in the precise soldering process, but also in the efficient, safe and gentle handling of sensitive assemblies, also in the rework area.

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Quickly informed, directly connected

Do you have questions about our products or need further information? You can contact us directly using the form below. In addition, we provide you with current brochures, data sheets and technical documents in the download area, simply call them up and use them immediately.

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Download our current brochures conveniently as PDF files. Here you will find all the important details about our products, technologies and services in a compact and clear format.

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Why IBL?

Technological lead for the highest soldering quality

Precise and safe soldering thanks to vapour phase technology

Integration into digital production

Networked soldering processes for the electronics production of tomorrow

Sustainable efficiency in operation

Energy-efficient processes and reuse of cardboard

Advice, service and partnership-based cooperation

IBL accompanies you from evaluation to series production

Technical data

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