MiniLab

MiniLab #2

Compact tabletop vapour phase soldering system

The MiniLab is an automated vapour phase soldering system in which the heat is transferred to the assembly to be soldered using condensed vapour. As a compact soldering system, the MiniLab is ideal for small series production, prototyping, laboratory work or as a companion for rework tasks. The system enables profiling with standardized production specifications.

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MiniLab - Compact reflow vapour phase machine

The MiniLab vapour phase machine impresses with its space-saving design and simple operation. The machine is designed for small batch production and guarantees the highest soldering quality with gentle temperature control.

The top-loading vapour phase soldering system guarantees a uniform temperature profile and enables soldering without overheating, ideal for sensitive components. Despite its compact size, the MiniLab impresses with its professional performance and reliable process reliability.

MiniLab front cut gate open
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The low soldering temperature and the homogeneous heat transfer of the MiniLab reduce the thermal load on the soldering assemblies to a minimum. This generally reduces component stress.

This makes the MiniLab one of the ideal small series soldering systems for:

  • especially gentle component soldering in assembly and connection technology
  • the use in the prototype or small series production

Simple processes, maximum flexibility

Due to the simple and safe soldering processes, the MiniLab is perfect for getting started with vapour phase soldering. The advantages at a glance:

  • manual loading from above
  • standard soldering profiles already included
  • intuitive operability
  • easy to move
  • soldering independent of assembly weight

The MiniLab is also an optimal solution in the field of batch soldering systems and represents a compact alternative to other bench soldering systems represent.

Product highlights

  • desktop unit
  • Einfache Bedienung durch 5″ Touch-Panel
  • patented closing of the soldering chamber during the charging and discharging process
  • patented automatic or time-controlled soldering process with automatic soldering

Further added value

  • oxygen-free soldering without overheating the components
  • low energy and medium consumption with liquid recovery system
  • maintenance-free transport system (patented)
  • viewing window into the process chamber
  • 230 V operation
  • illuminated viewing window into the process chamber

Discover more

  • attachment for double-sided assemblies
  • support grid for workpiece carriers
  • ReSy - a device for repairing QFPs and BGAs
  • external cooling unit
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Do you have questions about our products or need further information? You can contact us directly using the form below. In addition, we provide you with current brochures, data sheets and technical documents in the download area, simply call them up and use them immediately.

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Why IBL?

Technological lead for the highest soldering quality

Precise and safe soldering thanks to vapour phase technology

Integration into digital production

Networked soldering processes for the electronics production of tomorrow

Sustainable efficiency in operation

Energy-efficient processes and reuse of cardboard

Advice, service and partnership-based cooperation

IBL accompanies you from evaluation to series production

Technical data
DesignationValue
Width715 mm
Depth625 mm
Height580 mm
Weight70 kg
Max. Soldering material format304 x 274 x 80 mm
Max. Weight per carrier2 kg
Standard filling quantity3 kg
Water connection½"/2.5-5 bar
Max. heat output1.8 kW
Average power consumption0.8 kW/h
Tension208-240 VAC, 50/60 Hz
Fuse16 A gL / C16 A
DesignationValue
Width28.15 "
Depth24.61 "
Height22.83 "
Weight154.32 lbs
Max. Soldering material format11.97 x 10.79 x 3.15 "
Max. Weight per carrier4.41 lbs
Standard filling quantity6.61 lbs
Water connection½"/2.50-5 bar
Max. heat output1.80 kW
Average power consumption0.80 kW/h
Tension208-240 VAC, 50/60 Hz
Fuse16 A gL / C16 A

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