BLC Inline systems
BLC620i/820i

BLC 820 i

Premium inline vapour phase soldering system for the highest demands

The BLC inline series is a series of systems for reliable and efficient inline vapour phase soldering. The system offers environmentally friendly, reproducible and high-precision soldering with low void formation and excellent heat transfer.

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The BLC inline systems BLC620i/820i make it easy to implement the most complex soldering applications in assembly production. A mix of voluminous large and small components can be reliably processed simultaneously in the vapour phase soldering system without causing overheating and damage to the assembly.

Space-saving, flexible, versatile

The space-saving BLC inline series is available in different machine types with carrier sizes from 450 x 540 x 80 mm up to 850 x 540 x 80 mm.

The inline systems can:

  • be fully integrated into a production line
  • can also be used in batch mode if required

The Intelligent Profiling System (IPS) gives the user full control over the temperature rise and enables a soldering profile to be created in a single step.

Precision through patented technology

Together with the unique, patented Soft Vapour Phase, overheating of the components is ruled out. The BLC inline series has excellent heat transfer in an inert, oxygen-free atmosphere, without the use of expensive nitrogen.

The two-chamber system with large touch display makes this machine particularly user-friendly, as it:

  • is easy to set up
  • remains easy to use
  • delivers reliable results

The Intelligent Profiling System (IPS) enables easy and intuitive control of the thermal profile in the high-end range.

Low consumption figures lead to lower operating costs

The two-chamber design and integrated heat exchanger reduce energy consumption.
This is lower with the BLC inline series compared to other soldering systems, which saves operating costs.

Media consumption is also low, thanks to:

  • integrated medium recovery
  • minimum fluid consumption

Both factors contribute to overall cost- and resource-efficient production.

The BLC inline series also scores highly in terms of maintenance and service

  • all moving parts are located outside the process chamber
  • as a result: low wear and minimal maintenance
  • access to the soldering chamber is quick and easy, ideal for cleaning and servicing

Product highlights

  • patented vibration-free and maintenance-free transport system
  • highest precision and process quality with patented Soft Vapour Temperature Control (SVTC)
  • integrated PC enables permanent data acquisition and professional data management
  • two chamber design with medium recovery results in very low liquid consumption

Further added value

  • convenient 15" touch screen, mounted on a swivel arm
  • live temperature recording via IBL machine software
  • unlimited program memory with many sample programs
  • network-compatible
  • password-protected operating levels
  • lead-free and leaded soldering with only one medium with different soldering temperatures
  • buffer in the loading and unloading area and automatic loading and unloading of the workpiece carrier
  • energy management system
  • fill level control and automatic medium filtering
  • integrated cooling fan
  • minimal maintenance and low wear, as all moving parts are outside the process chamber
  • easy access to the soldering chamber for cleaning and maintenance purposes
  • viewing window into the soldering chamber

Discover more

  • wide range of options for PCB cooling
  • patented Rapid Cooling System (RCS)
  • up to 3 additional temperature measurement channels
  • multi-level mode for quick switching between different soldering heights
  • online temperature recording software (TRS) for data analysis and storage including alarm and event logging
  • pilot mode, measuring channel for simple temperature-controlled soldering and profile set-up
  • heat output monitoring
  • various traceability extensions for automated processes and traceability, ready for Industry 4.0
  • automatic adjustment of transport width and workpiece carrier
  • larger transport width
  • measuring workpiece carrier for recording LP soldering profiles
  • batch workpiece carrier and support grid
  • attachment for double-sided blanks on the batch workpiece carrier
  • TE adapter for easy insertion of LP thermosensors
  • heavy Duty "HD" model for loads up to 14 kg
  • various extensions for the extraction system
  • UPS - uninterruptible power supply
  • ReSy - a device for desoldering QFPs and BGAs
  • additional emergency stop switch on the rear of the machine
  • storage compartment for workpiece carriers
  • integration of a bypass system
  • cooling unit for indoors and outdoors with automatic switch-off
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Do you have questions about our products or need further information? You can contact us directly using the form below. In addition, we provide you with current brochures, data sheets and technical documents in the download area, simply call them up and use them immediately.

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Why IBL?

Technological lead for the highest soldering quality

Precise and safe soldering thanks to vapour phase technology

Integration into digital production

Networked soldering processes for the electronics production of tomorrow

Sustainable efficiency in operation

Energy-efficient processes and reuse of cardboard

Advice, service and partnership-based cooperation

IBL accompanies you from evaluation to series production

Technical data
BLC620iBLC820i
Width2020 mm2220 mm
Depth2490 mm2490 mm
Height1470 mm1470 mm
Weight920 kg1070 kg
Max. Soldering material format in inline mode630 x 400 x 55 mm630 x 400 x 55 mm
Max. Soldering material format in batch mode650 x 540 x 80 mm850 x 540 x 80 mm
Max. Weight per carrier7 kg7 kg
Standard filling quantity20 kg25 kg
Water connection½"/2.5-5 bar½"/2.5-5 bar
Max. heat output7.8 kW10.4 kW
Average power consumption3.2 kW/h3.6 kW/h
Tension400/230 VAC, 50/60Hz400/230 VAC, 50/60Hz
Fuse25 A gL / C25 A25 A gL / C25 A
BLC620iBLC820i
Width79.53 "87.40 "
Depth98.03 "98.03 "
Height57.87 "57.87 "
Weight2028.25 lbs2358.94 lbs
Max. Soldering material format in inline mode24.80 x 15.75 x 2.17 "24.80 x 15.75 x 2.17 "
Max. Soldering material format in batch mode25.59 x 21.26 x 3.15 "33.46 x 21.26 x 3.15 "
Max. Weight per carrier15.43 lbs15.43 lbs
Standard filling quantity44.09 lbs55.12 lbs
Water connection½"/2.50-5 bar½"/2.50-5 bar
Max. heat output7.80 kW10.40 kW
Average power consumption3.20 kW/h3.60 kW/h
Tension400/230 VAC, 50/60Hz400/230 VAC, 50/60Hz
Fuse25 A gL / C25 A25 A gL / C25 A

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