Software

User-friendly software solutions for efficient and reliable vapour phase soldering

A reliable vapour phase soldering process depends not only on high-quality equipment, but also on intelligent process control.This is exactly where the user-friendly software solutions from IBL Löttechnik come into play. The in-house developed software makes soldering processes predictable, traceable, and transparent. From simple operation and targeted control of relevant parameters to comprehensive evaluation and documentation, IBL creates the digital foundation for consistent quality, efficient machine operation, sustainable process steps, high repeatability, and maximum process stability.

Advanced Process Control
Mit der innovativen Advanced Process Control (APC) setzt die IBL Löttechnik GmbH neue Maßstäbe in der Dampfphasenlöttechnik. Die intelligente Steuerung kombiniert maximale Prozesssicherheit mit hoher Effizienz und transparenter Bedienung. Herzstück ist die Automatic Gradient Control (AGC), die eine intuitive Erstellung präziser Temperaturprofile ermöglicht – ganz ohne aufwendige Programmierung. Reale Gradienten und Haltezeiten lassen sich direkt definieren, wodurch reproduzierbare Lötprozesse in höchster Qualität sichergestellt werden, unabhängig von der Komplexität der Baugruppe oder der Erfahrung des Bedienpersonals. Das Ergebnis: weniger Fehlerquellen, reduzierte Ausschussraten und eine nachhaltig gesteigerte Produktivität.
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Pilot Mode
The Pilot-Mode simplifies the thermal profile realization as a thermocouple from the soldering application can be used to control the solder process and cycle, allowing a very precise and targeted process control. The user can define the setpoint temperature values for the specific product in the solder program and connect the thermocouple which should be used for the process control to the TC-socket of the machine. After the target thermal profile was achieved the software provides the AutoConvert-Function to easily convert the program to a production program, where a machine internal thermocouple will be used to the automatic process control.
Automatic Gradient Control (AGC)
The AGC offers automatic gradient control, which can be used to specify the temperature gradients for the various phases of the soldering profile in °C/sec in the soldering program. This feedback process parameters are automatically calculated and corrected in real time based on the actual temperature profile data.
Automatic Process Monitoring (APM)
The APM software enables product-specific definition of process values and process windows, as well as automatic production monitoring including an alarm function and data storage. During the production process, predefined values are continuously monitored and documented in real time using a target/actual comparison. In addition, a process status is generated and stored together with the measured data in the process log file.
Offline Profile & Program Editor
The Windows-Software is providing features to visualize process data like thermal profiles and solder programs and offers the possibility for analysis, modification and report of the data. The offline software was designed for the use on a workstation and does not require a direct connection to the soldering machine.
Traceability
The software consists of interface modules to allow the data interface to certain hardware extensions, as well as settings to realize different functions and combinations. The software delivers automatic and failure free identification and continuous documentation of received processed data. A connection to complex Manufacturing Executions Systems (MES) is possible and enables the interaction between the machine and such comprehensive systems.
Scanner
The system can be extended by a handheld or a fixed scanner. A fixed scanner allows different functions and levels of safety or traceability. It can be used for loading profiles etc. Whereas a fixed scanner is used in inline machines for setting of the transport width, correct profile etc.