The best soldering method achieving gentle heating and optimum quality
All soldering processes have one thing in common: they are able to securely attach components onto specified base
material. However, for greater process accuracy, higher quality solder joints, consistently repeatable heating, and
lower reflow costs, vapor phase soldering (also known as condensation soldering or vapor phase reflow), is the most
flexible, simplest and most reliable reflow soldering method. It is ideally suited for all types of SMT components and
base materials. It allows processing of all components without elaborate setup and without temperature profiling.
A chemically inert fluid is used for the heat transfer. This fluid is non-corrosive, electrically non-conductive and does
not deteriorate over time. The boiling point is very accurate depending on the application, most fluids have boiling
points between 200°C up to 235°C. Other temperatures are also available.
As soon as the fluid starts to evaporate, a layer of saturated vapor and condensing fluid covers the soldering area
creating an inert (oxygen-free) atmosphere. The vapor's weight is greater than the surrounding air and forms a
protective gas atmosphere (0 ppm oxygen) without the need for any additional gases, such as nitrogen. As soon as
the solder material is immersed into the vapor zone, the vapor condenses on the solder material and transfers its
heat. Irrespective of the time the solder material remains in the vapor, its temperature can never exceed the defined
maximum vapor temperature.
As a result, the solder process can be reliably reproduced and offers ideal pre-conditions for a reliable and repeatable
process control. The vapor phase soldering process achieves perfect results on a wide range of assemblies, from
flexible to multi-layer substrates, reliably without overheating.