Reduce Voids and Tombstoning
Products are getting smaller, yet customers want the same power and features. From a production standpoint, the combination of heavy mass and smaller components in an even smaller footprint is challenging for conventional convection soldering. It also increases inspection costs. Rework drives additional thermal cycles, which can lead to higher scrap rates.
Vapor Phase Addresses These Challenges
Vapor phase technology helps minimize voids and tombstoning. Vapor phase technology uses temperatures in the 215-235 degrees C range even for RoHS-compliant assemblies. Because the PCB is immersed in a vapor blanket with a inert environment perfect wetting properties are given. The equal heat distribution results in no temperature differences (DeltaT) on the whole PCB.
IBL’s patented Soft Vapor Phase (SVP) technology supports fast creation of customized profiles. The profile is driven by temperature set points and the assembly will not exceed the programmed temperature or the boiling point of the fluid. The ramp rate can be reduced at any temperature set point of the profile. This ability to control the speed of immersion and position in the vapor blanket limits tombstoning.
The combination of the vapour phase soldering process with a vacuum chamber significantly increases the reliability of the finished product. The reduction of voids is of major importance on small solder connections and on flat soldering connections of power electronics to improve the heat transfer. IBL’s vacuum systems provides a inert atmosphere throughout the entire reflow and vacuum process.