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Inline Vapor Phase Reflow

 

IBL’s CX600/CX800 is fully automated inline vapor phase soldering solution. It provides precise, high quality results at medium to high volume throughput. The machines feature a standardized SMEMA interface for easy inline integration.

Features:

  • Vapor Phase Inline System for high volume throughput
  • A cycle time of under 20 sec. per board is possible
  • Carrier sizes from 680 x 650 x 80 mm up to 825 x 650 x 80 mm
  • Fully automatic inline operation
  • Two independent stations for loading and unloading of carriers
  • Loading and Unloading conveyors with buffer function
  • Three internal process chambers with automatic airlocks
  • Lowest energy and fluid consumption with Energy management system
  • Highest precision and process quality with patented Soft Vapor Temperature Control (SVTC)
  • Easy one step profile set-up with Intelligent profiling system (IPS)
  • Wide variety of adjustable solder profiles
  • Lead-free and leaded soldering on one machine with one fluid
  • Live temperature monitoring with IBL Software without profiler
  • Traceability and documentation with IBL Software
  • Low maintenance due to Cool Handling (all moving parts outside process chamber)
  • Maintenance-free transport system (patented)
  • Integrated automatic fluid filter system
  • Observation window into process chamber
  • Batch and inline operation available
  • Siemens Interface available

Download Datasheet CX 600

Download Datasheet CX 800

     
 

SLC / BLC Inline

Features:

  • Powerful unit for highest demands
  • Different machine types with carrier sizes from 300 x 340 x 80 mm up to 840 x 540 x 80 mm
  • Small footprint
  • Low energy and fluid consumption with 2-chamber design and integrated heat exchanger
  • Highest precision and process quality with patented Soft Vapor Temperature Control (SVTC)
  • Easy one step profile set-up with Intelligent profiling system (IPS)
  • Wide variety of adjustable solder profiles
  • Lead-free and leaded soldering on one machine with one fluid
  • Live temperature monitoring with IBL Software (VP- Control) without profiler
  • Traceability and documentation with IBL Software (VP-Control) optionally with barcode function
  • Low maintenance due to Cool Handling (all moving parts outside process chamber)
  • Maintenance-free transport system (patented)
  • Integrated automatic fluid filter system
  • Observation window into process chamber
  • Optional patented Rapid Cooling System (RCS) for heat reduction of sensitive parts
  • Different sizes are available on request

Download Datasheet SLC / BLC Inline

     
 

VAC645/665 Inline

Features:

  • Powerful unit for highest demands
  • Different machine types with carrier sizes from 300 x 340 x 80 mm up to 840 x 540 x 80 mm
  • Small footprint
  • Low energy and fluid consumption with 2-chamber design and integrated heat exchanger
  • Highest precision and process quality with patented Soft Vapor Temperature Control (SVTC)
  • Easy one step profile set-up with Intelligent profiling system (IPS)
  • Wide variety of adjustable solder profiles
  • Lead-free and leaded soldering on one machine with one fluid
  • Live temperature monitoring with IBL Software (VP- Control) without profiler
  • Traceability and documentation with IBL Software (VP-Control) optionally with barcode function
  • Low maintenance due to Cool Handling (all moving parts outside process chamber)
  • Maintenance-free transport system (patented)
  • Integrated automatic fluid filter system
  • Observation window into process chamber
  • Optional patented Rapid Cooling System (RCS) for heat reduction of sensitive parts
  • Different sizes are available on request

Download Datasheet VAC645/665 Inline

     
     

 

 

 
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