Vacuum soldering technology provides maximum solder quality for void-free soldering.

VAC745/765

Features

  • Void-free solder joints with highest quality
  • Inert atmosphere during the whole reflow and vacuum process
  • Wide variety of adjustable solder profiles
  • Low medium consumption due to 2-chamber design and medium recovery
  • Temperature recording and profiling with 4 integrated channels
  • Permanent data collection
  • Medium level check and automatic medium filtering
  • Integrated cooling fan
  • Automatic monitoring of vacuum process
  • Maintenance-free transport system (patented)